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Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC

2015 International 3D Systems Integration Conference (3DIC)(2015)

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摘要
In this paper, crosstalk-included eye-diagram of high-speed interposer channels are estimated and investigated. To analyze the crosstalk effect of various interposer channels, silicon, organic, and glass substrates are compared under the same physical structure and dimensions. Moreoever, crosstalk-included eye-diagrams are estimated in short time with high accuracy using 8 worst input cases. The estimated crosstalk-included eye-diagrams are analyzed at data rate of 1 and 2 Gbps.
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关键词
crosstalk,eye-diagram,High-speed channel,silicon interposer,organic interposer,glass interposer,2.5D IC,3D IC
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