Fabrication and characterization of low-cost ultrathin flexible polyimide interposer
Microelectronics Reliability(2015)
Abstract
•A semi-additive process is used to fabricate an ultrathin flexible interposer.•These results imply that an increase in the grain size results in a rougher surface.•The proposed method is a proof-of-concept for 2.5-D/3-D integration using UFPI.
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Key words
Interposer,Flexible substrate,Semi-additive process
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