Chrome Extension
WeChat Mini Program
Use on ChatGLM
VIPCreated with Sketch.

Fabrication and characterization of low-cost ultrathin flexible polyimide interposer

Yu-Jung Huang,Ming-Kun Chen,Yi-Lung Lin,Shen-Li Fu

Microelectronics Reliability（2015）

Cited 5|Views16
No score
Abstract
•A semi-additive process is used to fabricate an ultrathin flexible interposer.•These results imply that an increase in the grain size results in a rougher surface.•The proposed method is a proof-of-concept for 2.5-D/3-D integration using UFPI.
More
Translated text
Key words
Interposer,Flexible substrate,Semi-additive process
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined