TSV Extracted Equivalent Circuit Model and an On-Chip Test Solution.
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems（2016）
摘要
Through silicon via (TSV) is the enabling technology for 3-D integrated circuit (IC) realization. To develop manufacturing tests for 3-D ICs, TSV has to be accurately modeled. Analytical methods are commonly used to develop circuit models for TSVs. These models are often difficult to develop and require some assumptions to simplify the problem. This paper presents a new method utilizing computer-a...
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关键词
Integrated circuit modeling,Circuit faults,Substrates,Solid modeling,Three-dimensional displays,Capacitance,Equivalent circuits
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