Toughening Of Thermosetting Resins With Thermoplastic Polyimide: Thermal, Morphological, And Mechanical Characterization

Synthesize a thermoplastic polyimide (TP-PI) by 4, 4'-Bisphenol A dianhydride (BPADA) and 4, 4'-diaminodiphenyl ether(ODA) to toughen thermosetting polyimide(TS-PI) of BPADA and 3-aminophenylacetylene (APA) system. Improve the toughness of matrix resin by control morphology of blends. The results show that the system has been phase separation, TP-PI as a continuous phase, blends is part miscibility or immiscibility. Compose materials anysis show that the adhesion of resin and fiber have been improved, toughness of resin-based composite materials has been improved at the same time without sacrificing original thermal properties and modulus.