Study on Dynamic Recrystallization Behavior of Cu-Ni-Si Alloy

The flow stress behavior of Cu-2.0Ni-0.5Si alloy during hot compression deformation was studied by isothermal compression test at Gleeble-1500D thermal-mechanical simulator. Dynamic recrystallization and dynamic recovery during high temperature deformation have been investigated by means of compression tests in the temperature and strain rate ranges of 873 to 1073 K and 0.01 to 5s(-1) under maxium strain of 60%. The results show the flow stress was controlled by both strain rate and deforming temperature,the flow stress decreases with the increase of deforming temperature,while increases with the increase of strain rate. The hot deformation equation is (epsilon) over dot = e(28.47)[sinh(0.013 sigma)](5.52) exp(-245.4 x 10(3)/RT).