Electroless Deposition of Nickel on the Surface of Silicon Carbide Crucible from Alkaline Bath

This work aims to eliminate contamination of the surface of crucible with silicon carbide during fusion preparation sample of the X-ray fluorescence analysis used in relation to electroless Ni-P plating process on the surface of SiC crucible in the alkaline bath. The structure, morphology and component of the coated layers were clarified by means of XRD, SEM and EDAX. Also, the electrochemical measurements was carried out to characterize the reduction mechanism of Ni deposition. The bath compositions were nickel sulfate 20 g/L, sodium hypophosphite 30 g/L, sodium citrate 10 g/L, ammonium chloride 20 g/L, containing a mixed additives of thiourea, sodium lauryl sulfate and coumarin. The thickness of coating was 3.47 mu m after plating for 15 min from this bath at 318 K. The coating is relatively dense and smooth and has a nodular surface morphology. The uniform Ni-P film is a mixture of microcrystalline of Ni5P4 and crystalline phases of Ni in the alkaline bath, with the components of 4.74% P and 95.26% Ni. The nickel deposition reaction occurs at -1.07 V appropriately with the peak current density of 32 mA/cm(2) and the electrochemical deposition of nickel is mainly controlled by the electrochemical process.