Single photon counting X-ray imaging with Si and CdTe single chip pixel detectors and multichip pixel modules

IEEE Transactions on Nuclear Science(2004)

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摘要
Multichip modules (MCM) have been successfully built and operated. These use 4 single-photon counting MPEC 2.3 chips that are bump bonded to 1.3 cm /spl times/ 1.3 cm CdTe or Si semiconductor pixel sensors. Single-chip detectors were built as well. The MPEC 2.3 chip provides a pixel count rate up to 1 MHz with a large dynamic range of 18 bits, 2 counters and energy windowing with continuously adju...
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关键词
Pixel,X-ray imaging,X-ray detection,X-ray detectors,Sensor arrays,Optoelectronic and photonic sensors,Multichip modules,Bonding,Dynamic range,Counting circuits
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