Single photon counting X-ray imaging with Si and CdTe single chip pixel detectors and multichip pixel modules
IEEE Transactions on Nuclear Science(2004)
摘要
Multichip modules (MCM) have been successfully built and operated. These use 4 single-photon counting MPEC 2.3 chips that are bump bonded to 1.3 cm /spl times/ 1.3 cm CdTe or Si semiconductor pixel sensors. Single-chip detectors were built as well. The MPEC 2.3 chip provides a pixel count rate up to 1 MHz with a large dynamic range of 18 bits, 2 counters and energy windowing with continuously adju...
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关键词
Pixel,X-ray imaging,X-ray detection,X-ray detectors,Sensor arrays,Optoelectronic and photonic sensors,Multichip modules,Bonding,Dynamic range,Counting circuits
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