A non-local void filling model to describe its dynamics during processing thermoplastic composites

A model is developed to describe the void dynamics within thermoplastic composite tape during the tape placement process. The model relates the volatile pressure in voids, the applied compaction load, fiber bed response and the resin pressure due to squeeze-flow of resin from resin-rich regions to fill void regions. This model relies on some geometric simplifications, but incorporates the relevant physical phenomena.