CRYOGENIC CONDUCTION COOLING TEST OF REMOVABLE PANEL MOCK-UP FOR ITER CRYOSTAT THERMAL SHIELD

This paper describes the fabrication of removable panel for ITER cryostat thermal shield (CTS) and its conduction cooling test at cryogenic temperature. Two kinds of full-scale mock-ups of the removable panels have been developed, depending on different thermal conduction designs. Passive cooling characteristics of the mock-ups are investigated with the measured data of temperature jump at the joint and maximum temperature at the panel. The passive cooling of panel with copper insertion satisfies the design requirement of temperature jump (< 3 K), even though the heat load condition in the cooling test is more severe than the design condition of CTS. It is clearly demonstrated that the copper strips bonded on the panel attenuate the temperature gradient of the panel. Different thermal behaviors at the joint are also found for the two mock-ups.