Thin MEMS Packages Obtained by a Novel Collective Cap Transfer Process

This paper reports the development of a novel 0-level packaging technology for (RF-)MEMS based on a collective cap transfer technique carried out on wafer scale. By taking advantage of the advances in temporary wafer support systems, it is now possible to fabricate very thin (below 100 mu m) capping dies and transfer these collectively in a single step at the wafer-level to a MEMS substrate. (C) 2011 Published by Elsevier Ltd.