Synthesis and Characterization of a Novel High-Temperature Structural Adhesive Based on MDA-BAPP-BTDA Co-Polyimide

A series of polyimide(PI) adhesives were synthesized from 2,2'-Bis [4-(4-aminophenoxy)phenyl] propane(BAPP), 4,4'-Diaminodiphenylmethane (MDA) and 3,3',4,4'-Benzophenonetetracarboxylic acid dianhydride (BTDA) via a two-step process. PI adhesives with different BAPP content were characterized in regard to their structure, thermal stability, mechanical properties and adhesive performance. Results showed that these PIs had excellent thermal stability, whose glass transition temperature (Tg) were around 300 degrees C. While, superior dynamic mechanical behavior was observed, and the maximum loss factor declined with the increase of BAPP content. Single-lap shear strength of over 15.58 MPa at room temperature was obtained, and it remained high even at the temperature of 350 degrees C. Factors that could affect bonding strength of these PI adhesives such as molar ratio of the diamine monomers, surface roughness of adherends and curing processes were investigated.