Experimental investigations on the soldering performances of the joints for Bi-2223/Ag tapes

Chunlong Zou, Yuntao Son,Xiongyi Huang,Chenglian Liu,Shahab Uddin Khan,Xi Weibin,Lu Kun

Physica C: Superconductivity and its Applications（2015）

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摘要

•Bi-2223/Ag jointed tapes were fabricated by five solder.•The solder have a different melting point.•The joint resistive were evaluated at liquid nitrogen.•Two different welding technique were compared.

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关键词

Bi-2223/Ag tapes,Joint resistance,Solder,Joining technique

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