Plasma Process. Polym. 11–12/2012
Plasma Processes and Polymers（2012）
Abstract
Cover: Local plasma treatment at atmospheric pressure of a 100 mm diameter silicon wafer carrying a wet-chemically etched topography with a height difference of 50 μm between recessed and elevated areas. Further details can be found in the article by Thomas et. al. on page 1086.
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Key words
plasma,polym,process
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