Fabrication And Characterization Of Thin-Barrier Al0.5ga0.5n/Aln/Gan Hemts

IEEE ELECTRON DEVICE LETTERS(2011)

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Abstract
The growth, fabrication, and performance of Al0.5Ga0.5N/AlN/GaN high-electron-mobility transistors (HEMTs) with a total barrier thickness of 7 nm are reported. An optimized surface passivation and an ohmic recess etch yield HEMTs exhibiting 0.72 S/mm peak extrinsic dc transconductance at a current density of 0.47 A/mm. Devices with a gate length of 90 nm achieve 78 GHz unity-current-gain frequency and up to 166 GHz maximum frequency of oscillation. The minimum noise figure at 10 GHz is 0.52 dB with an associated gain of 9.5 dB.
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Key words
Aluminum gallium nitride, high-electron-mobility transistors (HEMTs), microwave noise, recessed ohmic contacts, surface passivation
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