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A High-Temperature Die-Bonding Structure Fabricated at Low Temperature for Light-Emitting Diodes

Lichin Cheng,Chihming Chen,Mingguan Chen,Chichang Hu,Hsinyi Jiang,Rayhua Horng,Dongsing Wuu

IEEE Electron Device Letters（2015）

Cited 11|Views8
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Abstract
A trilayer of Sn/Bi/Sn was deposited on a heat sink substrate as the die-bonding material for a light-emitting diode. The eutectic feature of the Sn/Bi system allowed the die-bonding to be carried out at a low temperature using a facile thermocompression process. Two thin Sn layers were sacrificed to form two intermetallic compounds sandwiching the Bi layer, and this high-temperature die-bonding s...
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Key words
Light emitting diodes,Thermal resistance,Thermal management,Thermal analysis
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