Micromachined Substrate Slots For Rf On-Chip Isolation

MICROWAVE AND OPTICAL TECHNOLOGY LETTERS(2015)

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摘要
A CMOS-compatible substrate slotting technique is demonstrated in CMOS 0.18 mu m technology to improve RF isolation. Isolations in 50 and 100 mu m distances are improved by 32 and 28 dB, respectively. Experiments show substrate signal attenuates isotropically on the substrate surface and a substrate network that can model the substrate slot. (C) 2015 Wiley Periodicals, Inc.
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关键词
integrated circuits, isolation, RF, substrate, micromachining
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