Preparation of Sub-20-mu m Conductive Silver Pattern Using Photosensitive Silver Paste

Photosensitive silver paste was formulated by mixing microsized silver powders, polymeric binders, acrylic monomers, and photoinitiators in an organic medium. A conductive silver line pattern with a width of sub-20 gm was successfully prepared through the simple photolithography process on a poly(ethylene terephthalate) film Strong adhesion and high electrical conductivity of up to 2.8 x 10(-4) Omega cm were accomplished in the presence of triethylamine as an activating agent, which enables the facile sintering of silver particles into a conductive silver pattern, which is critical for the construction of touchscreen panels with a narrow bezel width.