Assembly of N type Bi2(Te, Se)3 thermoelectric modules by low temperature bonding

Solid liquid interdiffusion technique is employed to attach N type Bi-2(Te0.92Se0.08)(3) thermoelectric material to alumina substrate. The surface finishes of the bonding surfaces for Bi-2(Te0.92Se0.08)(3) and alumina are Ni and Ag respectively. The bonding layer is pure Sn. The growth kinetic of intermetallic compounds and their microstructure evolution during aging at 200 degrees C was established. The success of this bonding technique provides a cost effective way to assemble thermoelectric modules at a low temperature for higher temperature applications.