High Temperature Pt/Alumina Co-Fired System for 500 C Electronic Packaging ApplicationsLiangyu Chen,Philip G Neudeck,David J Spry,Glenn Beheim,Gary W Huntermag(2015)引用 23|浏览7暂无评分关键词electronic packaging,metallizing,prototypes,circuit boardsAI 理解论文溯源树样例生成溯源树,研究论文发展脉络Chat Paper正在生成论文摘要