Comparative analysis of high-frequency transitions in Embedded Wafer Level BGA (eWLB) and Quad Flat no Leads (VQFN) Packages

Embedded Wafer Level Ball Grid Array (eWLB) is one of the most advantageous packaging technologies with respect to higher I/O density, process easiness, integration flexibilities and electrical performance. When it comes to high-frequency (HF), the latter has to be considered particularly. The Quad Flat no Leads Package (VQFN) has often been the choice due to good LW-performance. We present the comparison of the two package technologies eWLB and VOFN. In this paper we present an optimized 24 (Wiz chip-package-board transition. We compare the performance of an eWLB package to a VQFN package. We focus on a single-ended transition. We obtain a simulated insertion loss better than -0.5 dB in eWLB compared to -1.5 dB in VQFN. In this contribution we show the outstanding potential of the eWLB package for mm-wave applications.