Vernier Si/Pi Co-Simulation

2013 17TH IEEE WORKSHOP ON SIGNAL AND POWER INTEGRITY (SPI)（2013）

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摘要

The majority of time and effort spent to analyze and design a PC interconnect is not well served by commercial SI/PI tools. This paper examines those usage models and suggests improvements that would result in higher adoption rates of commercial SI/PI tools.

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关键词

SI/PI, co-simulation, BER, HVM, interconnect

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