Advances On Yield Learning Through Concurrent Evaluation Of Design And Process Data

2009 IEEE/SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE(2009)

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摘要
This paper presents advances in methodologies and tools for yield learning which are concurrently exploiting design, test and process data. In our experiments, we demonstrated how to understand yield losses correlated with excessive power drawn from the chip during functional electrical test of wafers.
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关键词
volume diagnostics,ATPG,scan chain,hot spots,systematic failures,yield learning
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