Research of new packaging and cooling technique for high power fiber laser used pump coupler

Proceedings of SPIE(2015)

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Abstract
This article analyzes the advantages and disadvantages of a packaging structure for pump coupler, where common heat conduction material is used. In this study, the possibility of using new technology of thermal conductivity is discussed. We also proposes a solution that make the function and effect of package more uniform. A serial of experiments are done for research the cooling effect and the working reliability of the fiber combiners and couplers. Experiment proves that after improved method of package, the cooling speed increases significantly comparing the sample with old type of package technique. The technique discussed in this paper will make the high power fiber laser working long time with steady power output and high efficiency.
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Key words
high power laser,fiber laser technique,package technique,pump combiner,fiber device
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