Development of Novel Architecture and Assembly Techniques using the Flip-Chip Bonding Method
Y Saitoh,Junko Yamanaka, Hiroshi Suzuki,Syohei Miyahara, Mamoru Kamiya, K Kadoi, Takahiro Masuda, K Maemura,Mayuri Inoue, Atsushi Suzuki,Hiroya Takeuchi,Masaki Mandai, Hiroyuki Kanazawa,Y Higashi, Hiroko Ikeda,S Koike,T Matsuda,H Ozaki, M Tanaka,T Tsuboyama,Sylvie Avrillon, S Okuno,J Haba,H Hanai,Shinsaku Mori,K Yusa mag（1993）
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