A Multiple Wavelength Vertical-Cavity Surface-Emitting Laser (Vcsel) Array For Optical Interconnection

We describe an application of InGaAs/AlGaAs VCSELs to multiple wavelength light source for optical interconnection. A flip-chip bonding technique is used to integrate the VCSELs lasing at different wavelengths. The integrated VCSELs of different wavelengths are individually grown and processed, so that one can optimize the device characteristics and the wavelength separation or distribution for multiple wavelength interconnection systems. A 9-wavelength VCSEL array with a wavelength separation of 5 nm has been successfully fabricated.