Degradation in Multi Layer Interconnects by Fast Thermal Cycling Stress

Văn Hiếu Nguyễn,Cora Salm, J. Vroemen, J. P. Voets,B.H. Krabbenborg,J. Bisschop,A.J. Mouthaan,F.G. Kuper

openalex(2001)

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Key words
multi layer interconnects,fast thermal cycling stress,degradation
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