Development Of Electromagnetic Analytical Models For Substrate Noise Propagation In Integrated Circuits

In this paper, electromagnetic analytical models for substrate noise propagation are developed for its use in electromagnetic compatibility performance prediction for integrated circuits. The propagation mechanisms for surface waves caused by injected currents are studied and models covering different substrate technology options are provided. In addition, closed-form expressions for interference prediction are derived in order to provide useful information regarding substrate noise coupling at early stages of the design process.