Silicidation Induced Strain Phenomena In Totally Silicided (Tosi) Gate Transistors

PROCEEDINGS OF ESSDERC 2005: 35TH EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE(2005)

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摘要
In this paper, we present a detailed analysis of the performance and transport characteristics in totally Ni silicided (TOSI) devices. For two different TOSI integration schemes, we study transconductance variations of TOSI devices with respect to poly-Si gated devices. We find a clear signature of process induced strain related to the total gate silicidation step which depends largely on the integration scheme used for the fabrication of the TOSI devices.
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关键词
nickel,chemical mechanical polishing
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