Tri-Gated Poly-Si Nanowire Sonos Devices

PROCEEDINGS OF TECHNICAL PROGRAM: 2009 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATIONS(2009)

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摘要
Si nanowire (NW) SONOS devices have recently been demonstrated as a good candidate for high-density non-volatile memory application [ 1][2]. Owing to the high surface-to-volume ratio of the NW channel, the programming and erasing (P/E) operation of the device could be performed at a lower voltage and much faster speed over the planar counterpart [2]. However, the fabrication of NW devices typically requires advanced lithographic tools and or complicated process flow. These are not compatible with the manufacturing of flat-panel products where the device feature size is generally several microns or larger. In this work, we propose a simple and cost-effective approach to integrate planar poly-Si thin-film transistors (TFTs) and tri-gated poly-Si NW SONOS devices without resorting to advanced lithographic tools. Greatly enhanced P/E speed with the use of NW structure is clearly demonstrated.
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关键词
logic gates,thin film transistors,temperature measurement,cost effectiveness,si,fabrication,erbium,thin film transistor,tunneling,manufacturing,silicon,programming,voltage,nanowires,nonvolatile memory
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