The Extrapolation Of Failure Rate Of Electrical Components In Specific Operational Conditions

2015 23RD TELECOMMUNICATIONS FORUM TELFOR (TELFOR)(2015)

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摘要
This paper deals with a method for estimating the reliability of the electronic components, that are used in the design of electronic devices within complex systems. Mentioned methods provide a common base for comparison and evaluation of the design reliability and represent a tool that allows increasing the reliability of the proposed device. This article discusses a stress models, derived from the international standard SN EN 61709 ed.2 and reliability prediction handbook MIL-HDBK-217, which allows estimation of the effect changes in the environmental conditions on component reliability.
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关键词
Stress Model,Extrapolation,Failure Rate,MIL-HDBK-217F,CSN EN 61709
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