Delamination Root Cause in Temporary Bonding
ECS Transactions(2014)
摘要
The goal of the presented work is to study the delamination root cause in temporary bonding using thermoplastic material as adhesive. The parameters potentially involved in this mechanism are defined, and each of them is separately studied. At the end, the combination between some of the parameters is also tested. Finally the mechanism at the root of the delamination is discussed.
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关键词
temporary bonding
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