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Improvement of Thermal Stability of Ni Silcide by Additive Metals with Specific Introduction Processes

Hiroshi Iwai,Kuniyuki Kakushima,Parhat Ahmet,Takashi Shiozawa,Koji Nagahiro,Kazuo Tsutsui

5th International Symposium on ULSI Process Integration - 212th ECS Meeting（2007）

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Abstract
A new processe to improve thermal stability of Ni silicide, so called PSMD (post silicidation metal doping) in which additive metals were introduced to pre-formed NiSi was proposed. In situ deposition of thin Hf or Pt layer on the NiSi layer resulted in improvement of thermal stability evaluated by sheet resistance and morphology in the following RTA process at higher temperatures.
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Key words
ni silcide,additive metals,thermal stability
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