Mechanical testing and fracture analyses of miniaturized ZnO-based multilayer components

K. Macurova,M. Gruber,M. Pletz, P. Supancic, R. Danzer, F. Aldrian,R. Bermejo

International Symposium on Microelectronics(2015)

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摘要
Functional components are commonly fabricated combining a ceramic substrate with external and/or internal metallization (e.g. metal electrodes, vias, contact pads, etc.) using a tape casting process. Different layers are printed and/or fired (e.g. up to 800°C) onto the ceramic part to provide the component with a (certain) functionality. As a result of the combination of different materials (e.g. ceramic, glass, metal alloys) with different coefficients of thermal expansion, internal stresses may arise during the different fabrication steps. Although some of these tensile residual stresses may relax due to plastic deformation of metallic materials, stress concentrations generated in material junctions or terminations (imposed by geometrical constrains) may lead to cracks and/or reduce the component strength. In this work different architectures combining metal and glass layers on the surface of ZnO substrates were investigated experimentally and numerically in order to identify weak points in commercial components. Mechanical testing using three-point-bending was performed on samples taken after different steps. A FE model was developed to (i) calculate residual stresses generated during the manufacturing process, and (ii) simulate the propagation of initial crack/defect during manufacturing. Experimental results were compared with numerical predictions. These results in combination with fractographic analyses were used to validate the finite element model in order to assess location of failure.
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crack propagation
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