Power Delivery Modeling For 3d Systems With Non-Uniform Tsv Distribution
2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)(2013)
Abstract
This paper reports on power delivery modeling for 3D systems where through-silicon vias (TSVs) are not uniformly distributed, but are arranged at the peripheries of circuit blocks and die edges. The voltage drop (IR) and di/dt noise on the power delivery are modeled and compared with those given by uniformly distributed TSVs. The impact of TSV density and circuit block size, and their tradeoffs are evaluated.
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Key words
noise,electric potential,solid modeling,power electronics,voltage drop
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