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排名必读论文期刊顶会热点AI 简史溯源树小脉星探人才迁徙塔尖人才国防情报追踪开源工具智慧手语
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CuAl Alloy Interconnects as a Solution to the Trade-off between Reliability and Defect Density

Takeshi Furusawa,Daisuke Kodama,Hiroshi Miyazaki, Masayuki Matsumoto,Junko Izumitani, Hiroyoshi Matsumoto,Sakuzo Fukui,Keiji Hashimoto,Shigeki Tawa, Michiyo Okada,Kimio Tomita,Yasunori Nagaki,Yuji Minoura,Akio Ishii, N Amou,K Mori, Kazuteru Maekawa,Naohito Suzumura,Kazuo Honda,Yoshinobu Hirose, Aya Osaki

Extended Abstracts of the 2006 International Conference on Solid State Devices and Materials（2006）

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reliability,trade-off
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