Finite Element Analysis and Experiment Validation of Highly Reliable Silicon and Glass Interposers-to-Printed Wiring Board SMT Interconnections

Interposers that support high input/output density are becoming critical for system miniaturization and high performance. Silicon and glass are emerging as the primary candidates for such high-density interposers, due to their outstanding dimensional stability, which enables layer-to-layer wiring with small vias. However, silicon and glass have very low coefficient of thermal expansion (CTE), 3-8 ...