High-Conductivity Adhesive for Light-Emitting Diode Die-Attachment by Low-Temperature Sintering of Micrometer-Sized Ag Particles

Teppei Kunimune,Masafumi Kuramoto,Satoru Ogawa,Miki Niwa,Masaya Nogi,Katsuaki Suganuma

IEEE Transactions on Components, Packaging and Manufacturing Technology（2012）

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摘要

A paste composed of micrometer-sized Ag particles and an organic solvent formed a soft porous bonding layer under atmospheric conditions at 200°C and above. Using this Ag paste for die-bonding of a light-emitting diode (LED) resulted in excellent thermal resistance and reliability. Ag/Ag interactions are thought to be responsible for internal bonding, and the Ag paste does not bond strongly to oth...

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Bonding,Resins,Light emitting diodes,Polymers,Substrates,Plastics

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