Integrating and Interfacing Flexible Electronics in Hybrid Large-Area Systems

Warren Rieutortlouis,Josue Sanzrobinson,Tiffany Moy,Liechao Huang,Yingzhe Hu,Yasmin Afsar,J C Sturm,Naveen Verma,Sigurd Wagner

IEEE Transactions on Components, Packaging and Manufacturing Technology（2015）

引用 14|浏览17

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摘要

An approach to creating large-area systems is described that combines flexible thin-film electronic sensor surfaces with complementary metal-oxide-semi-conductor (CMOS) integrated circuits (ICs). Complete systems are built by lamination of multiple layers, consisting of thin-film subsystems and CMOS ICs on a passive flexible substrate. A flexible passive backplane provides in-plane interconnection...

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关键词

Inductors,CMOS integrated circuits,Substrates,Capacitors,Couplings,Copper,Backplanes

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