Phenomenological Study of the Effect of Microstructural Evolution on the Thermal Fatigue Resistance of Pb-Free Solder Joints

Richard J Coyle,J W Osenbach,Maurice N Collins,Hays W Mccormick,Peter H Read, Dan B Fleming,R Popowich,Jeff Punch,Michael B Reid, S Kummerl

IEEE Transactions on Components, Packaging and Manufacturing Technology（2011）

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摘要

Unlike SnPb solders, the thermal fatigue reliability of the Sn-Ag-Cu (SAC) solders is believed to be influenced significantly by both the initial and evolving microstructures. This paper presents a phenomenological study of the relationship between the initial SAC solder joint microstructure, the evolving microstructure, and the thermal fatigue performance measured by accelerated temperature cycli...

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关键词

Microstructure,Soldering,Fatigue,Temperature,Reliability,Thermal resistance,Aging

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