Resistance Analysis and Fatigue Life of COG Assemblies Under Thermal Cycle Aging

This paper reports the resistance change and fatigue behavior of chip-on-glass (COG) modules undergoing various aging time of cyclic temperature, electric current, and stress by shear fatigue tests. It is noted that as the COG assemblies are exposed in the environment of cyclic temperature, the relative resistance of COG assemblies decreases initially and then increases with the thermal cycling ag...