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Modeling Isolation-Induced Mechanical Stress Effect on SOI MOS Devices

2003 IEEE INTERNATIONAL SOI CONFERENCE, PROCEEDINGS(2003)

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摘要
In this paper, the mechanical stress effect of SOI MOS devices was analysed. The width dependence of stress effect and drain current shift were evaluated.
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关键词
MIS devices,MOSFET,elemental semiconductors,semiconductor device models,silicon-on-insulator,stress effects,SOI MOS devices,Si,drain current shift,modeling isolation-induced mechanical stress effect
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