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Fabrication of Etched Facets and Vertical Couplers in InP for Packaging and On-Wafer Test

Santos, R.,D'Agostino, D.,Soares, F.M.,H Rabbani Haghighi, K A Williams,X J M Leijtens

Photonics Technology Letters, IEEE（2015）

Cited 5|Views25
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Abstract
In this letter, the fabrication and the characterization of angled and straight etched facets in InP-based technology are reported. In addition, we report on etched facets combined with coupler mirrors for vertical outcoupling, realized with a wet-etching process.
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Key words
Photonic integrated circuit (PIC),etched facets,on-wafer testing,vertical couplers
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