SOI-enabled Three-Dimensional Integrated-Circuit Technology

C. K. Chen,B. Wheeler,D. R. W. Yost,J. M. Knecht,C. L. Chen,C. L. Keast

2010 IEEE International SOI Conference (SOI)（2010）

引用 7|浏览5

关键词

integrated circuit interconnections,silicon-on-insulator,three-dimensional integrated circuits,3D device interconnect approach,3D footprint,3D stack,SOI-enabled three-dimensional integrated-circuit technology,high yield 3D through-oxide-via,series resistance,through-silicon-via

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要