Nano- und micro sized filler particles for improved humidity resistance of encapsulants

This paper describes the potential of different nano- and micro-sized particles as additives for plastic packaging materials for enhanced humidity resistance/barrier enhancement within microelectronic packages as well testing methods for material characterization concerning their humidity diffusion and absorption properties. This topic is gaining increased importance when considering the trend towards System in Package, where a multitude of components is encapsulated to form one miniaturized SiP that incorporates a large number of different material interfaces and interconnects. These SiPs need to be protected from the environment by encapsulants layers with ever decreasing thickness and thus increased moisture barrier properties.