Impact of solder-joint tilting on the reliability of LED-based PCB assemblies: A combined experimental and FEM analysis
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems（2015）
摘要
The impact of solder-joint tilting on the reliability of high-power LEDs soldered on PCBs is investigated by means of FEM simulations correlated with thermal cycling experiments. A non-uniform solder joint stand-off height is implemented into the FEM and, using crack propagation modelling approach, the number of cycles to complete fracture are predicted.
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关键词
assembling,cracks,finite element analysis,integrated circuit reliability,light emitting diodes,printed circuits,soldering,thermal analysis,fem analysis,pcb assembly,combined experimental,crack propagation modelling approach,high-power led,nonuniform solder joint stand-off height,reliability,solder-joint tilting,thermal cycling experiments
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