Packaging of Ka-band patch antenna and optoelectronic components for dual-mode indoor wireless communication
Electronic Components and Technology Conference（2011）
Abstract
In this paper, we present a RF/FSO dual mode communication module formed by a Ka-band patch antenna and optoelectronic components. A LED and a PiN diode are bonded on the patch antenna as the front-end transceiver of the FSO communication channel. The patch antenna is modified to accommodate LED/PiN assembly with minimized crosstalk between the RF channel and the optical channel. Both the simulation and the experimental measurement validate that the interference between the Ka-band RF signals and the visible/infra-red optical signal is negligible. This new module can achieve 5 Gbps end-to-end FSO data transmission with RF channel backup.
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Key words
electronics packaging,indoor communication,light emitting diodes,microstrip antennas,optical transceivers,p-i-n diodes,ka-band patch antenna,led,pin diode,rf channel backup,rf-fso dual mode communication module,bit rate 5 gbit/s,dual-mode indoor wireless communication,end-to-end transmission,free space optical communication,front-end transceiver,optical channel,optoelectronic components,packaging,visible-infrared optical signal,front end,wireless communication,patch antenna,infra red,data transmission,communication channels
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