Tsv-Less Bsi-Cis Wafer-Level Package and Stacked Cis Module

Z. C. Hsiao,C. T. Ko,H. H. Chang,H. C. Fu,C. W. Chiang,W. L. Tsai

2013 8TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT)（2013）

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关键词

CMOS image sensors,copper,gold,nickel,silicon,tin,wafer level packaging,Cu-Ni-Au,Cu-Sn,Cu/Sn bumps,Si,Si substrate,TSV-less BSI-CIS wafer-level package,UBM,ZoneBOND technology,back-side illuminated CMOS image sensor,front-side processes,glass wafer,solvent dipping,stacked CIS module,thermal compression bonding,ultra-wafer thinning technologies

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