Extracting physical IC models using near-field scanning
Electromagnetic Compatibility（2010）
摘要
Accurate modeling of chip and chip-package is critical for EMI (Electromagnetic Interference) and RFI (RF Interference) analysis and prediction. In this paper, a model based on an array of dipoles from near-field measurement is proposed. A simple active circuit is simulated in a 3-D full-wave simulation tool, and the dipole model is calculated from the near-field data in the simulation using inverse method with regularization technique. This model has clear physical meaning, and it is validated using field at other place.
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关键词
active networks,integrated circuit packaging,inverse problems,radiofrequency interference,3d full-wave simulation tool,emi,rf interference analysis,rfi analysis,active circuit,chip-package,dipole model,electromagnetic interference analysis,inverse method,near-field measurement,near-field scanning,physical ic model extraction,regularization technique,data models,magnetic moments,near field,chip,electromagnetic interference
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