On ultra-short wireless interconnects for NoCs and SoCs: Bridging the ‘THz Gap’
Circuits and Systems（2013）
摘要
We review and analyze the critical features of ultra-short range wireless links. These features will be required for advancing NoC and SoC integration to the next level, as transistor scaling and hetero-integration on silicon substrates are expected to reach their full potential by the end of the decade. Based on published transceiver data, the scalable wireless NoCs for multi-core processors and reconfigurable networks for SoCs are within reach of Si/SiGe BiCMOS technology in the next few technology generations. However, before such THz-band CMOS wireless transceivers can become reality and work efficiently, compact high-gain on-chip antennas, high-density on-chip inductors with magnetic cores, and tunable-gain LNAs/PAs that can lower power consumption will be necessary.
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关键词
bicmos integrated circuits,ge-si alloys,elemental semiconductors,integrated circuit interconnections,microwave links,millimetre wave integrated circuits,multiprocessing systems,network-on-chip,radio transceivers,reconfigurable architectures,bicmos technology,cmos wireless transceivers,sige-si,soc,compact high gain on chip antennas,high density on chip inductors,magnetic cores,multicore processors,power consumption,reconfigurable networks,scalable wireless nocs,transistor scaling,tunable gain lna,tunable gain pa,ultrashort range wireless links,ultrashort wireless interconnects,network on chip
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