Demonstration of 30-Tbps/cm2 bandwidth density by silicon optical interposers fully integrated with optical components

Yutaka Urino, Steven K Akiyama,Takeshi Akagawa, Toru Baba,Tatsuya Usuki, Dai Okamoto,M Miura,Junichi Fujikata, Toshifumi Shimizu,Makoto Okano,Nobuaki Hatori,Masashige Ishizaka,Takashi Yamamoto,Hidemi Takahashi,Yoshikazu Noguchi,Masayuki Noguchi, M Imai,Masakazu Yamagishi, Shigeru Saitou,Naoki Hirayama, Masaki Takahashi, E Saito,Daisuke Shimura,Hideaki Okayama,Yosuke Onawa,Hiroki Yaegashi, H Nishi,Hiroo Fukuda,Kenneth M Yamada, Masaya Mori, Tadao Horikawa,T Nakamura,Yoshichika Arakawa

Optical Communication（2013）

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摘要

Silicon optical interposers for inter-chip interconnects, integrated with lasers, optical splitters, modulators, waveguides and photodetectors on a single silicon substrate were demonstrated. They were optically complete and closed systems. We achieved 20-Gbps error-free data transmission and a 30-Tbps/cm2 bandwidth density using these interposers.

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关键词

integrated optoelectronics,optical beam splitters,optical communication equipment,optical interconnections,optical modulation,photodetectors,waveguide lasers,si,bandwidth density,bit rate 20 gbit/s,error-free data transmission,integrated lasers,integrated optical components,interchip interconnects,optical modulators,optical splitters,optical waveguides,optically closed system,optically complete system,silicon optical interposers,single silicon substrate

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